Traditional Culture Encyclopedia - Photography major - X-ray examination and industrial computed tomography
X-ray examination and industrial computed tomography
The quality of high-resolution acquisition depends on several parameters, including understanding the sensitivity of polymers to X-rays, clear phase contrast and the definition of resolution parameters required for specific analysis. High-resolution CT acquisition requires high stability of X-ray source focusing, but it also requires high stability of samples. Lightweight materials are sensitive to X-rays and will be deformed during scanning. High-resolution detection of composite materials is a powerful tool for nondestructive display of fiber orientation and distribution. After the samples are obtained and reconstructed, the material components can be distinguished by the defined gray values.
Industrial CT is different from ordinary X-ray examination. It reconstructs three-dimensional images by continuously collecting 2D tomographic images, so it can collect more information and has stronger detection ability. It can not only detect the shape, position and size of defects, but also determine the properties of defects by density analysis technology, which is a comprehensive qualitative problem that has long plagued defects such as spatial positioning and depth quantification. The solution to the problem of nondestructive testing personnel is more direct. Therefore, the international nondestructive testing community regards industrial CT as the best nondestructive testing method.
UFJ's high-precision industrial CT system UNC225CT came into being. It can be used for industrial CT nondestructive testing of various products, such as small metal parts, electrical components, composite materials, medium-sized metal parts and large non-metallic workpieces. Large fan angle, wide fan beam and powerful image processing function can accurately identify various defects of the inspected workpiece.
At present, industrial CT has become the most important development direction of nondestructive testing with its powerful detection function. The company may wish to consider its development trend when purchasing test equipment. CT equipment pays more attention to details and has high image processing accuracy, including motion accuracy and rotation accuracy. Before 3D synthesis can be performed, the images taken at each angle must be μ-level. If there is deviation, there will be mistakes in synthesis. If it cannot be calibrated, the image will be very blurred and the defect position may be obscured. This is the technical difficulty of CT equipment.
At present, 2D equipment is widely used in the market, which can meet the testing needs of most customers. Both have their own advantages, depending on the company's requirements for inspection images. At present, the internal structure design of products in many industries is more complicated and the products are more and more refined, so CT equipment should be the best choice.
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