Safety requirements for dust-free workshops

1. Clean room instructions

1. Before entering the clean room, you must inform the manager and pass basic training.

2. Smoking, eating (drinking), and foreign debris (such as newspapers, magazines, pencils, etc.) are not allowed in the clean room. Running around and chatting at gatherings are strictly prohibited.

3. Before entering the clean room, you must take off your shoes in the designated place, put your shoes in the shoe cabinet, put your outer clothes in the closet, and put personal items in the private cabinet. No food can be placed in the cabinet. .

4. When entering the clean room, you must first wear the mask, dust-free cap, dust-free clothes and shoe covers in the dressing room in accordance with the regulations and procedures, then wash the dust in the air clean room and step on the dust-removing carpet (on the floor of the dust room) before entering.

5. When wearing a mask, the mask should be worn over the nose, covering the mouth and nostrils to avoid contaminating the chip when breathing.

6. Before putting on dust-free clothes and dust-free hats, you should tidy up your clothes and hair to avoid being uncomfortable after putting on dust-free clothes and dust-free hats.

7. After tidying up, wear a clean cap first. The principles for wearing a clean cap are:

(1) Hair must be completely covered in the cap and must not be exposed.

(2) The hem of the dust-free cap should be spread evenly over the shoulders. After putting on the work clothes, it will not come out and expose the shoulders and neck.

8. After wearing the dust-free hat properly, put on the dust-free clothes. The size of the dust-free clothes should be appropriate to avoid the risk of trouser legs or sleeves being too short and exposing the skin. Pay attention when dressing. The hem of the hat should be kept flat, and dust-free clothing cannot be worn backwards.

9. Put on shoe covers after wearing dust-free clothes, pull on the shoe covers and flatten them to cover the trouser legs.

10. When wearing gloves, avoid touching the palms and fingertips of the gloves with bare hands (to prevent sodium ion contamination). After putting on the gloves, place the wrists of the gloves inside the sleeves to prevent Isolate sources of pollution.

11. Only after wearing dust-free clothes, washing the dust, and stepping on the dust-removing blanket can you enter the clean room.

12. Regardless of entering or leaving the clean room, you must take off your clean clothes in the changing room as required. You cannot do this in other areas, especially when walking in the clean room.

13. Clean clothes, shoe covers, etc. should be cleaned regularly. If they are damaged or disconnected, they should be replaced with new ones immediately.

14. When taking off the dust-free clothes, the order is reverse to that of putting it on.

15. The dust-free clothes that have been taken off should be hung up and placed in the upper cabinet in the locker room; shoe covers should be placed under the hung dust-free clothes.

16. Except for dust-free clothes and other prescribed items, no other items are allowed to be placed in the small cabinets in the locker room.

17. Except for specified papers and items, no other items are allowed into the clean room.

18. Clean clothes, etc. are not allowed to be taken out of the clean room and should be placed in the prescribed place after use.

19. Masks and gloves can be kept or reused depending on the situation.

20. Anything entering the clean room must be wiped clean with alcohol.

21. Before entering any equipment, please inform the manager and wipe it clean outside the dust-free room before entering.

22. Instruments that have failed the assessment are prohibited from use. In case of emergency, appropriate procedures must be followed, such as turning off water, electricity, gas, etc. switches.

23. Fire must not be allowed in the clean room to avoid accidents.

2. Clean room operation instructions

1. When handling chips, you must wear fiber-free gloves and use clean tweezers to hold the chips. Do not use your fingers or anything else. If something comes into contact with the chip, the contaminated chip must be cleaned before it can continue to be used:

(1) If the front end of any tweezers (that is, the end holding the chip) has been touched, or the tweezers If it falls on the ground, it must be cleaned. Do not wipe dirty tweezers with paper towels or cloth.

(2) If the chip has been touched by fingers before proceeding to the next process after cleaning, it must be cleaned again.

(3) Place the chip on the quartz boat and prepare to enter the furnace tube. If the tweezers used are found to be dirty or there is obvious contamination caused by the tweezers on the chip, the chip must be cleaned again. And replace with clean tweezers immediately.

2. The chip must be placed in a box, covered and stored in a specified location, with as little exposure as possible.

3. Avoid talking on the chip to prevent saliva from splashing on the chip. Before the chip enters the diffusion furnace, please pay special attention to prevent the above actions. If the chip is stained with fiber debris, use nitrogen gas. Gun spray.

4. When taking out the chip from a Teflon wafer boat, Quartz Boat or other carrier, you must lift it vertically upward to avoid scratching the chip. The microscope lens must be The chip can be removed from the suction holder only after the chip has been separated.

5. If an oxide layer has grown on the chip, do not use a diamond knife to mark the chip before sending it to the yellow light chamber.

6. During operation, no matter whether you wear gloves or not, your hands must not be put into the cleaning sink.

7. When using a chemical station or oven to process chips, be sure to place the chips in a Teflon wafer boat. Do not use plastic boxes.

8. When placing the chip in the quartz boat, if the chip falls to the ground or in your hands, the chip must be cleaned again before entering the oxidation furnace.

9. Do not touch the inside of the chip box. If it is touched or contaminated by broken chips, it must be cleaned again.

10. Do not leave gloves, waste paper and other miscellaneous items on the operating table. Gloves must be replaced if they are burnt, frayed or have excessive fiber.

11. Never open unfamiliar instruments and various switch valve control buttons or handles without instruction.

12. If there is a strange smell or unusual reaction, color, sound, etc., please notify the relevant personnel immediately.

13. If the equipment is damaged due to incorrect operation, be sure to inform the person in charge or the teacher immediately.

14. Chip boxes entering and leaving the clean room must be kept clean and sealed with plastic wrap. Violators are not allowed to enter.

15. Ball pens and dust-free notebooks are always used for recording in the clean room. Ordinary paper and pencils are not allowed.

3. Instructions for operating in the yellow light area

1. Humidity and temperature will affect the alignment work. Pay attention to the temperature and humidity in the yellow light area, and reduce the amount of light near the alignment machine. people to reduce humidity and temperature changes.

2. Chips with photoresist that have not yet been exposed must not be carried out of the yellow light area to avoid exposure to light.

3. The chip that has been coated with photoresist and is waiting for alignment and exposure should be placed in an opaque blue-black crystal box, and the lid of the box must be closed properly.

4. When using the photomask, you should hold it by the edge and do not touch the photomask surface. Under any circumstances, the photomask chromium film must not come into contact with other objects to prevent scratches. Dust on the photomask can be removed by nitrogen. The gun blows it.

5. During exposure, avoid looking directly at the mercury lamp of the exposure machine.

IV. Instructions for using tweezers

1. After entering the laboratory, you should first put on gloves before taking out the tweezers to avoid contamination.

2. Only clean tweezers can be used to handle the chip. Once the tweezers are dropped on the ground, touched by hands, or contaminated for other reasons, they must be cleaned before use again. .

3. After use, tweezers should be placed in the designated places of each station and cannot be placed arbitrarily. If there are tweezers for special processes, they should be kept by themselves after use and cannot be mixed with tweezers from each station in the laboratory.

4. The tweezers should be held in a "pen-holding" posture to pick up the chip.

5. When picking up the chip, pick it up from back to front. When putting the chip back, put it back from front to back to avoid scratching the surface of the chip.

6. When picking up the chip, place the "short side" (saw-shaped head) on the front of the chip and the "long side" (flat head) on the back of the chip. Hold the blank part of the chip and do not damage the chip.

7. Do not touch the tweezers to the acid tank or D.I Water tank.

8. Tweezers can only be used to pick up chips and are not allowed to be used for other purposes.

5. Instructions for the use of chemicals

1. The entry and exit of chemicals must be registered, the manager must be notified, and a Material Safety Data Sheet (MSDS) must be attached at the laboratory door.

2. Before using chemicals, please read the Material Safety Data Sheet (MSDS) carefully and inform the manager.

3. Before acid change, you must wear an acid-proof plastic skirt, acid-proof long-sleeved gloves, goggles on your head, and plastic acid-proof shoes on your feet before you can perform acid change.

4. Do not open the lid of the acid bottle at will. Lock the lid immediately after use.

5. When diluting acid, be sure to add acid to water and never add water to acid.

6. Do not taste any chemicals or use your sense of smell to determine the contents of the container.

7. Do not shake or turn the container upside down when you do not know what kind of medicine is in the container.

8. All chemical work must be done in a well-ventilated or exhaust place.

9. When operating various acids, you must read the operating specifications carefully.

10. Acids and alkalis can be stored together in storage cabinets with ventilation equipment, but they must not be stored together with organic solvents.

11. Please put the waste acid into the waste acid bucket. Do not dump it randomly, let alone mix it with organic solutions.

12. Place waste organic solutions in organic waste liquid barrels, and do not dump them randomly or into waste acid barrels.

13. Do not change the solution in the container arbitrarily.

14. If you want to bring in a solution by yourself, please inform the person in advance and obtain permission before you can bring it in. If the solution you want to bring in by yourself is dangerous, it must be assessed before you can bring it in, and please mark it on the container. Clearly label container contents and shelf life.

15. Waste liquid treatment: Waste liquids are divided into acid, alkali, hydrofluoric acid, organic, etc., and are processed and registered separately. The recycling barrels are clearly marked. The waste liquid barrels contain acids and bases such as hydrofluoric acid. Never touch it with your hands.

16. Treatment of water leakage or acid leakage: When water leakage or acid leakage occurs, to ensure safety, never touch it with hands. First turn off the main power switch and related valves, and then use a dust-free cloth or acid-base Treat it with an adsorbent and report it to the administrator.

6. Chemical workstation operation

1. When operating, you must wear rubber gloves and a mask in accordance with regulations.

2. Do not put the plastic box into the acid tank or cleaning tank.

3. Before adding any solution, be sure to confirm the solvent in the container before adding.

4. When working at a chemical workstation, you should develop a good working posture and avoid leaning your upper body forward over the chemical tank and cleaning tank. This can prevent dangers and reduce the chance of contamination.

5. When the chemical station is not in operation, those who have a cover should cover it at all times and turn off the water switch of the cleaning sink.

6. When chemicals splash on clothes, skin, face, or eyes, the splashed area should be flushed with water for more than 15 minutes until the skin color returns to normal, and first aid treatment should be arranged immediately.

7. When chemicals are leaked, respond quickly and handle them appropriately. If necessary, evacuate according to instructions.

8. Use rubber gloves on each chemical workstation. Avoid touching each machine, workbench, and other equipment. Please wear dust-free gloves for general operations.

7. RCA Method

1. DIWater 5min

2. H2SO4:H2O2=3:1, boil for 10~20min at 75~85℃, remove metal, Organic, oil

3. DIWater 5min

4. HF:H2O 10~30sec, remove native oxide layer (Native Oxide)

5. DIWater 5min< /p>

6. NH4OH:H2O2;H2O=1:1:5, boil for 10~20min at 75~85℃, remove metallization

7. DIWater 5min

8 . HCl:H2O2:H2O=1:1:6 Boil 10~20min 75~85 ℃ Deionization

9. DIWater 5min

10. Spin Dry

8. Cleaning precautions

1. If there is water, pour water first and H2O2 last. The numerical ratio is the volume ratio.

2. Organic and acid-base products must not be mixed, and the operating platforms must be used separately.

3. Pour the acid-base solution into the recovery tank after cooling, and rinse the glass with DI Water for 5 minutes.

4. Wash empty acid and alkali bottles with water and place them separately in outdoor recycling bins according to plastic bottles and glass bottles.

5. Hydrofluoric acid will corrode bones. If it comes into contact, immediately apply calcium gluconate and water, then rinse with clean water and seek medical advice. If other acids and alkalis are encountered, rinse immediately with large amounts of DI Water.

6. After cleaning, the Wafer should be placed in DI Water as much as possible to avoid contamination.

7. The simple cleaning steps are 1-2-9-10; the cleaning steps for SiO2 are 1-2-10; the cleaning steps for Al are HCl:H2O=1:1.

8. The steps to remove the positive photoresist are 1-2-10, or immerse in ACE and oscillate with ultrasonic waves.

9. Each glass or tank has a specific solution to be filled. Etching, cleaning, electroplating, and organic must not be mixed.

10. There are five types of waste liquid recycling: acid, alkali, hydrofluoric acid, electroplating, and organic. They are recycled separately and recorded. Before dumping, check the waste compatibility table to make sure it is correct before dumping.

Clean room system

Usage operation method

1. First turn on the electric heating operation, pressurized windmill operation, dust bath operation, Exhaust windmill operation and other switches.

Note:

* The temperature controller and humidity controller can be adjusted by the yellow button. Generally, the temperature control is 20℃ DB and the humidity control is 50% RH.

*The voltage switch on the controller panel on the left is RU, and the current switch is T. The voltage switch on the right controller panel is RS and the current switch is OFF.

2. Turn on the air supply switch of the box-type air conditioner, and then turn on the air-conditioning and heating switch after the air supply is stable. At this time, the red light will light up, indicating normal operation.

Note:

＊The starting sequence of air conditioner is compressor NO.2.

* The temperature is adjusted so that the pointer points to red heater 5.

* The shunt switch AIR VALVE is ON.

3. After using the clean room, turn off the box air conditioner and press the stop button.

4. Then turn off the electric heating operation, pressurized windmill operation, dust bath room operation, exhaust windmill operation and other switches on the controller panel in sequence.

Gas cylinder

Instructions for use

1. Use the handle to open the gas cylinder counterclockwise to the end, and turn OUTLET on and PURGE off.

2. Use the black knob to adjust the pressure (psi) of the gas cylinder. The clockwise direction increases and the counterclockwise direction decreases.

3. Adjust the N2 cylinder to 40psi (20psi in the yellow light room), and adjust the AIR cylinder to 80psi (60psi in the yellow light room).

4. After using the gas cylinder, use the handle to close the gas cylinder clockwise to the end, close OUTLET and open PURGE to discharge the gas in the pipeline and close PURGE.

Pure water system

Usage operation method

1. Valve control

(1) Valve (VALVE) V1, V2, V3 , V4, V6, V8, V10, V12, V13, V14, V16, V17, V19 should be kept fully open.

(2) Valves V5, V7, V11, V18, and V21 should remain fully closed.

(3) Valves V9 and V20 are for pressure regulation and cannot be fully opened or fully closed.

(4) Among the valves, V5 is the BY-PASS of the sand filter, V15 is the BY-PASS of the U.V. lamp, V18 is the BY-PASS of the DI bucket, and V21 is the BY-PASS of the RO membrane.

2. Automatic water production

Step 1: Position the switch of each ball valve according to the above valve control.

Step 2: On the control box, keep each switch in the OFF position.

Step 3: Switch the system operation switch on the control box to the ON position.

Step 4: Activate solenoid valve 1 and perform initial discharge first.

Step 5: Solenoid valve 2 activates water production.

Step 6: At this time, PUMP1 and PUMP2 are activated in sequence, the system produces water normally, and the RO produced water enters the water storage tank (TANK) through the pipeline. When the water is full, the high liquid level indicator light on the control box lights up. The system automatically shuts down and activates water production again when the water level in the water storage tank drops to the low level.

3. System water supply

Switch the night cycle-stop-water switch on the control box to water. At this time, the PUMP3 delivery pump is activated, and the pure water in the TANK is After being transported to U.V., DI barrels and precision filtered, it can be used at various use points on site.

4. Night circulation

The night cycle-stop-water switch on the control box is mainly based on the hygiene considerations of the pipeline after the water supply is stopped after get off work every day or during consecutive holidays. The steps are:

(1) After stopping the water supply for 59 minutes, the system will automatically supply water for another 1 minute.

(2) Thereafter, the water supply will be circulated for 1 minute every 59 minutes until the circulation stops at night.

5. System detection

This system is equipped with various pressure gauges, flow meters and conductivity meters to control system operation. Its functions are as follows:

Pressure gauge 1: Sand filter water inlet pressure

Pressure gauge 2: RO water inlet pressure

Pressure gauge 3: RO drainage pressure

Pressure Table 4: DI water inlet pressure

Pressure gauge 5: Water supply return pressure

Flowmeter 1: RO drainage flow

Flowmeter 2: RO produced water flow

In addition, the control box (machine room) is equipped with a two-segment LED conductivity display, which can switch the display of raw water and produced water respectively.

6. System maintenance

HF-RD system, consumables that should be updated regularly:

(1) The sand filter should be reversed regularly.

(2) The pre-filter should be updated every 1-2 months.

(3) Membrane tubes should be cleaned or updated as necessary depending on their removal rate and water production volume.

(4) The apparent resistance value of the resin mixed bed is updated.

(5) Precision filtering is updated approximately every 2-4 months.

7. Troubleshooting

Troubleshooting possible factors of the phenomenon

The system shuts down and the system cannot be activated 1. Abnormal external power supply 2. The system operation switch is not pressed 3 . System circuit failure 4. Motor/pump failure 1. Check the system power circuit 2. Press the system operation switch 3. Notify the manufacturer 4. Update the motor/pump

Low water production 1. The membrane tube drainage is too high High 2. Insufficient pressure 3. Membrane tube blocked 1. Adjust the drain valve V92. Clean the membrane tube or update the membrane tube

Low specific resistance 1. Decreased resin function 2. Decreased RO removal rate 1. Replace the resin 2 . Replace the RO film group

Mask alignment machine

Usage method

Introduction to the exposure machine

In the semiconductor manufacturing process, coating After the photoresist is laid, the chip must be exposed and developed by UV ultraviolet light. This exposure machine is the OAI200 series, which integrates mask alignment, UV ultraviolet light exposure and development, UV ultraviolet light measurement device and mask clamping device.

OAI200 series is an entry-level mask aligner that can manually change various usage parameters, such as exposure time, exposure intensity, exposure power, etc. It has good development effects for mid-to-high-end line widths. This series can use up to four-inch chips, and the maximum exposure power is 1KW.

Steps for using the exposure machine

1. Check whether the nitrogen cylinder and the nitrogen valve and air valve of the yellow light chamber are open. Turn on the red main switch on the extension cord below the exposure machine, then turn on the exposure machine and microscope.

2. Connect the power supply of the tunnel exhaust motor, carry out the ventilation steps of the exposure machine, and check whether there is air intake from the air inlet behind the mercury lamp holder above the exposure machine. If the air volume is small or there is no air intake, the power of the mercury lamp cannot be turned on (an alarm will sound). Only after confirming that there is air intake from the air inlet can you turn on the ON/OFF switch of the mercury lamp power supply under the exposure machine.

3. Press and hold the START button of the mercury lamp power supply for about 1 to 3 seconds. At this time, the current value will increase (which means the mercury lamp lights up and starts to consume current). Release the button immediately. The mercury lamp is lit.

4. After the mercury lamp is lit, it must be left on standby for at least 30 minutes to stabilize the Lightsource system. If the mercury lamp fails to light, please do not perform any repairs.

5. After the system is stable, fill in the voltage and current values ????on the power supply on the record sheet, and register it as a record every time you turn on the light.

6. Unscrew the screws of the photomask clamp, and place the front (chrome-plated side) of the photomask facing down. Align it with the three reference points, press the MASKVAC. button, let the vacuum suck the photomask, and then lock it. Screw to secure the reticle.

Note:

＊ The mask holder must be lowered before placing the mask. Pull MASK FRAME UP/DOWN to raise or lower MASKHolder.

Lock the two black iron edges next to it.

* Check whether the CHUNK, the circular base on which the chip is placed, is lower than the photomask to prevent the photomask from crushing the chip.

7. Turn up the MASK FRAME UP/DOWN button to raise the MASKHolder, place the chip on the CHUNK, turn the SUB VAC. button to ON, let the vacuum suck the chip, and pull down the MASK FRAMEUP/DOWN button , causing the MASK Holder to be put down.

8. Turn the Ball LockButton to Unlock, and slowly rotate the Z knob clockwise to raise the chip base until the transmission belt feels tightened. Then rotate the ZKnob counterclockwise about 15 blocks, and turn the Ball Lock Button to Lock.

Note:

＊Z knob is about 15 microns per grid.

＊ Rotating the Zknob counterclockwise will lower the base on which the chip is placed. The purpose is to allow a slight distance between the chip and the mask during alignment so that the chip and the mask will not directly rub against each other.

* If alignment is not required, you do not need to rotate the Z knob counterclockwise.

* When rotating the Zknob, whether clockwise or counterclockwise, when the belt slips, it means that the chip base is in contact with the photomask. At this time, it cannot be rotated counterclockwise, which will cause the internal bolts to loosen.

* CHUNK ¨ Z ¨ ADJUST is generally between 15A and 20 A, and the smaller the current, the looser the belt.

9. Move the microscope base to the top of the photomask to perform alignment correction between the chip and the photomask. If you need to adjust the position of the chip, you can use the fine-tuning lever next to the chip base to correct the X, Y, and θ of the chip base.

10.

100 SEC

1000 SEC

RESET

EXPOSE

SEC

The left side of the exposure machine panel is as shown below:

Note:

＊There are two settings for the exposure seconds, one is 1000SEC and the other is 100SEC. When 1000SEC is pressed, the counter can be set to a maximum exposure time of 999 seconds; when 100SEC is pressed, the counter can be set to a maximum exposure time of 99.9 seconds.

* When setting the exposure seconds, first measure the brightness of the mercury lamp. First press LAMP TEST, then press and hold the button on the handle to move the base to the left end of the exposure machine, and then place the OAI 306 UVPOWERMETER. Just click on CHUNK. Press RESET after completion, and you can measure several different positions to see whether the brightness of the mercury lamp is uniform. The measured unit is mw/cm2, which can be converted into mJ units by multiplying by time (SEC). .

11. After setting the exposure seconds, you can proceed with the exposure process.

Turn CONTACT VAC. to ON and N2 PURGE to ON, a slight vacuum will be generated between the chip and the photomask.

Note:

*The range of CONTACT VAC ADJUST is generally around red-25kpa.

12. Press and hold the button on the handle, then the base can move to the left end of the exposure machine. Release the button, and the exposure machine will automatically perform the exposure action.

13. After the exposure is completed, the base can be moved back to the right end of the exposure machine. Turn the N2 PURGE to OFF. Then turn CONTACTVAC. to OFF, and the instrument will fill with nitrogen to break the vacuum between the mask and the chip, making it easier for the user to take out the chip.

14. Rotate the Z knob counterclockwise to lower the chip base to the lowest point. Loosen the black-edged iron frame that fixes the mask, and pull up the MASK VAC. button to break the vacuum of the MASKHolder and take out the mask.

15. Turn the MASK FRAME UP/DOWN to UP to raise the MASK Holder. Turn SUBVAC. to OFF, use the chip clip to remove the chip, and then turn MASK FRAME UP/DOWN to DOWN.

16. If another exposure is required, the above steps can be repeated.

17. After completing all exposure procedures, first turn off the microscope light source generator, and then turn off the mercury lamp power supply. 〈Do not turn on the mercury lamp again within one hour after turning off the light, which has extended the life of the mercury lamp〉

18. First turn off the tunnel exhaust motor power, turn off the exposure machine switch SYSTEMON/OFF to OFF, and then turn it off Disconnect the extension cord main switch under the exposure machine. After the exposure machine has cooled down, finally turn off the nitrogen valve and air valve on the wall.

Thermal evaporation machine

Usage and operation methods

A. Start-up steps

1. Turn on the main power switch on the back of the machine.

2. To turn on the cooling water, you need to activate the D.I Water system first.

3. Turn on RP and heat the engine for 2 minutes.

4. Open the three-way valve to the F.V position and wait for 2 minutes.

5. Turn on DP and warm up the machine for 30 minutes (Sample cleaning and loading can be performed while the engine is warming up to save time).

B. Loading

1. Open the Vent and close it immediately after air intake.

2. Open Chamber.

3. Loading Sample, Boat and Metal.

4. Use Shutter to block Sample.

5. When closing the Chamber, be sure to pay attention to whether the door is tight. Because the machine is in disrepair, you usually have to press the upper right corner of the door tightly with your hands.

C. Vacuuming

1. Initial pumping

(1) Switch the three-way valve to the R.V position (it is best to switch to F.V every few minutes) to prevent the pump oil and gas molecules in the DP from diffusing into the chamber).

(2) When the vacuum gauge VAP-5 displays 5?10-2 torr, switch the three-way valve to F.V and wait for 30 seconds.

2. Fine pumping

(1) M.V ON, record time.

(2) ION GAUGE ON, press Fil to ignite the filament (it needs to be below 10-3 Torr to complete the gas extraction).

D. Evaporation

1. When the pressure is about 2-10-5 Torr, start adding liquid nitrogen.

2. When the pressure is lower than 2-10-6 Torr, record the pressure and pumping time and turn off the ION GAUGE.

3. Heater Power ON (make sure the Power adjustment knob is reset to zero).

4. Select BOAT1 or BOAT2.

5. When evaporation begins, please note that the current needs to increase slowly.

Note:

* When gold plating, the current on the meter is about 100A. When Al plating, the current can be slightly smaller, about 70~80A.

* When the BOAT emits red light due to high heat, the viewing window should be closed immediately to prevent metal from adhering to the glass of the viewing window.

* After empty plating for a few seconds to clean the metal surface to be plated, you can open Shutter and start evaporation.

＊After the evaporation is completed, immediately turn off the HeaterPower and wait 10 to 15 minutes for the BOAT to cool and the evaporated metal to cool down to avoid oxidation caused by immediate contact with air before venting to break the vacuum.

E. Breaking the vacuum

1. The Substrate Hold temperature needs to be lowered to normal temperature.

2. ION GAUGE POWEROFF.

3. M.V OFF.

4. DP OFF cooling for 30~60 minutes.

5. Open the Vent (close it immediately after air intake).

6. Open Chamber and take out Sample and BOAT.

7. Close the Chamber and be sure to close the door tightly.

F. Shut down

1. Turn off F.V.

2. Turn on the R.V, pump it to 0.01 Torr and then turn it off.

3. Turn on the F.V. After 30 seconds, the three-way valve will switch to the closed position.

4. RP OFF.

5. Turn off the main power.

6. Turn off the cooling water.

7. Turn off nitrogen.

Note:

* During evaporation, the current should be increased slowly and should not be too high to avoid a large amount of metal vaporizing in an instant, making the thickness difficult to control.

* If it is used by others, the liquid nitrogen can be filled with a little less, about one-third of the cylinder.

Oxidation furnace tube

Usage and operation methods

Introduction to oxidation furnace tube

The oxidation furnace tube used in this laboratory is Lenton LTF1200 The horizontal tubular furnace can hold 2-inch silicon wafers. The heating area is larger than 50cm. The maximum temperature can reach 1200°C and can last for 24 hours. The maximum operating temperature is 1150°C. The temperature control method adopts PID microcomputer automatic temperature controller.

Purpose

After exposing the silicon chip to a high temperature and oxygen-containing environment for a period of time, we can grow a layer on the surface of the silicon chip that has good adhesion to silicon and is electrically conductive. The insulator - SiO2 whose properties meet our requirements.

Note:

* Before turning on the oxidation furnace, you must first make sure that the HEATSwitch is set to the O-off state. The l will glow when the Switch is powered on, and the oxidation furnace will begin to heat up.

* If the over-temperature protection device is good, please make sure the alarm point setting is appropriate for the current use. If the overheating protection device is good, the buzzer will sound, and there is a consistent alarm program during overtemperature control operation.

* In order to improve the thermal impact of the quartz glass tube or bushing, the maximum heating rate cannot exceed 3°C per min.

* In order to reduce heat loss, correct operating procedures must be determined, and the quartz glass tube can be sealed with appropriate use of insulating bolts and radiation shielding.

* Do not turn off the oxidation furnace at maximum temperature when operating the oxidation furnace to extend the life of the oxidation furnace.

Operation steps:

1. Check whether any abnormal problems occurred in the previous operation and fill in the operation record.

2. Check the machine status

(1) Control panel status: Make sure the HEATSwitch is set to O off before use.

(2) Heating controller: Lenton LTF 1200 temperature >400°C, the temperature difference between the front and rear furnaces is ?40°C.

(3) Gas control: H2OFF, O2 OFF.

3. Slowly push the chip into the furnace tube.

4. Open the H2 and O2 switches on the wall and the gas cylinder pressure regulating valve in the machine room.

5. Set the preset gas (H2, O2) flow value and furnace temperature.

6. Press HEATSwitch to l. At this time, the furnace temperature will slowly heat from the constant temperature (400°C) to the standard process temperature of 1100°C. The maximum heating rate cannot exceed 3°C per min.

7. Take out the chip after the furnace temperature drops to constant temperature.

8. Turn off H2 and O2.

9. Close the H2 switch at the rear end of the furnace tube, the switch on the wall, and the gas cylinder pressure regulating valve in the machine room.

10. Check whether the furnace tube has completed the shutdown action.

11. Fill in the end time of the operation record and exception protection and explanation.

Coating machine

Instructions for use

1. First insert the power plug of PUMP into the power socket at the back of the coating machine.

2. Insert the plug of the coating machine into the 110V power socket, and then press the POWER button.

3. Set the rotation speed and time. This model is a two-stage acceleration Spin Coating. The right side is the first stage of acceleration, and the left side is the second stage acceleration.

4. Depending on the substrate size, different rotating turntables can be replaced for coating.

5. Press the PUMP button. At this time, the rotating turntable will suck the substrate, and then apply the photoresist in a spiral shape from the center of the substrate to the outside evenly and slowly to an appropriate amount. During the photoresist coating operation, nitrogen gas can be used to blow clean the surrounding area of ??the rotating turntable and the substrate.

6. Close the protective cover of the coating machine to prevent the photoresist from splashing out of the coating machine.

7. Press the START button, and the coater will start coating.

8. After coating is completed, open the protective cover, press the PUMP button and rotate the turntable to release the substrate, and the substrate can be taken out.

Hot air circulation oven

Instructions for use

1. The voltage of this machine is 110V/60HZ.

2. After confirming the voltage, plug the power cord into the 110V socket.

3. Turn on the POWER switch, and the thermometer PV will display the actual temperature in the box.

4. First press the SET key?, SV will keep flashing and you can start to set the temperature. The subtitle window of SV will show high brightness. You can set the required temperature in the high-brightness position. , just press the SET key again and the high brightness will move accordingly, and the temperature can be set in the high brightness place.

5. Press the UP key ▲ to indicate the temperature increases upwards, and press the ▼ key ▼ to indicate the temperature decreases downwards.

6. After completing the above temperature setting (SV is still flashing), just press the ENT key once and the SV will display the temperature just set (PV displays the actual temperature).

7. When the heating lamp OUT display light is on, it means that the machine is heating, and when it reaches the set point, OUT will flash on and off (normal phenomenon).

8. When the AT light is on, it means that the temperature is automatically calculated.

9. When the ALM-1 red light is on, it means the temperature is overheated (the temperature will automatically cool down).

10. When the ALM-2 red light is on, it means the temperature is too low (the temperature will automatically heat up).

11. Temperature range: 40℃~210℃.