Traditional Culture Encyclopedia - Hotel accommodation - Introduction of Hon Hai Technology Group
Introduction of Hon Hai Technology Group
In East China, the Group gradually promoted the industrial layout from 1993, and successively established bases in Kunshan, Hangzhou and Shanghai. Among them, Kunshan Industrial Park has been the world's largest PC connector manufacturer for seven consecutive years. In March 2003, Hangzhou Qiantang Science and Technology Industrial Park started construction, and a wireless communication industrial base integrating R&D, design and production will rise along the Qiantang River.
Foxconn (Beijing) Science and Technology Industrial Park, which started construction in 200 1 and was initially completed and put into operation in 2002, is the global headquarters of the Group's wireless communication. The industrial park will effectively integrate the group's parts manufacturing capabilities in South China and East China, and then provide customers with all-round manufacturing and customer service from key parts to system assembly.
In May, 2003, Peixin Semiconductor and Innolux Optoelectronics under the Group were fully introduced to Taipei, Kunshan and Shenzhen, marking the substantial long-term layout of the Group in the field of semiconductor equipment and LCD panel industry.
From June 5, 2003 to 10, the large-scale Taiyuan industrial park started construction (opened in May 2004). This industrial park is the largest foreign investment project in Shanxi Province, focusing on developing 3C products, alloy materials, precision molds, auto parts and other products. In 2004, Foxconn (Yantai) Science and Technology Industrial Park entered the stage of planning and implementation, and will be built into the largest 3C science and technology industrial base in Shandong Peninsula. The group is leading the trend in the computer, communication and consumer electronics industries and enjoys a high reputation. Is one of the world's three largest EMS (Electronic Manufacturing Service) manufacturers, and has formed a long-term strategic alliance with the world's top computer, communication and consumer electronics manufacturers.
In order to meet customers' needs in time and seize market opportunities, the group also creatively implemented the transnational business strategy of "R&D in two places, design and manufacturing in three places, and global assembly and delivery", and established ECMMS (e-component module move &; Service) has completely subverted the rules of the game in the field of electronic professional manufacturing.
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