Oppo r 1 1 will it be exactly the same as before after changing the screen?

If it is the original screen, it is basically the same as the original screen; If it is a normal screen, it may not be as good as the previous screen after replacement, and there will be some jams, but the shape is basically the same as the original.

There are some small details on the back cover:

1, there are many copper pieces on the inside, which are the connecting contacts of the mobile phone antenna. The reason why there are so many is that the shell surface of R 1 1 adopts a micro-slot antenna, which looks beautiful, but it requires more signal overflow.

2. There are four obvious small round holes above the back cover, corresponding to OPPO LOGO. Koala guessed that it should be related to the mosaic of LOGO. In order to facilitate processing and ensure stable embedding effect, four small holes are reserved on the back cover;

3. There are four small contacts in the middle of one side of the volume key, but there are no shrapnel or components that can be linked in the corresponding places of the screen components. In fact, many mobile phones will leave similar "suspense". In most cases, a function is designed at the beginning, or a technology is used, but problems or defects are found in the final finalization test or trial production, and the function is finally castrated. However, the shell has been made according to the design, so it is impossible to throw it away, so these contacts have also been preserved.

Then look down, R 1 1 Although the appearance is similar to that of iPhone 7 Plus, the internal structure is completely different. IPhone is an L-shaped motherboard+long battery, arranged left and right, while R 1 1 is still a common three-stage design, and there is not much strangeness. To give an inappropriate example, for example, a person looks like a star and looks like an appearance, but the inner thing is still different, just a skin.

The following disassembly is a routine, first disconnect the BTB of the battery, and then deal with other cables. No matter the main board or the auxiliary board, there are corresponding metal baffles covering BTB connectors and components. For example, there are metal baffles on the vibration unit of BTB and LCD module. All chips on the motherboard have shielding covers, the outer layer is covered with heat sinks, and the inside is coated with silicone grease, which is a common heat dissipation routine, but no heat dissipation treatment is found on the inside of the back cover. Does this mean that engineers have great confidence in the temperature control of Snapdragon 660?

Half of the shields on the motherboard can be opened. Let's start with the two biggest ones. Qualcomm Qualcomm logo printed with MDM660 is Snapdragon 660 SOC. To be honest, when so many mobile phones are disassembled, SOC can rarely be seen directly, because in most cases, the processor will be stacked and packaged with RAM, and only RAM can be seen outside. Next to the processor, printed with KMDH600 1DM is a memory combination of 64GB ROM+4GB RAM. The supplier is Samsung Electronics, which adopts eMCP packaging, that is, eMMC and MCP packaging smart phone storage standards.

Next to the processor and covered by the shielding cover, there are three important chips, namely SDR660 RF transceiver, which is a supporting IC released at the same time as Snapdragon 660. After upgrading the latest X 12 LTE modem, SDR660 can achieve a peak downlink speed of up to 600 Mbps, supporting 2x2 MIMO 802.11ACWI. At the same time, this chip also supports Bluetooth 5.0, and the power consumption is reduced by 50-75% compared with the previous generation. Next to the MFI707 RF antenna switch, next to the memory is NXP's TFA9890A audio amplifier, which has appeared on vivo X5Max before.

Looking at the other side, the two LOGO are the same, with Skywork printed on them, namely 77643-3 1 and 779 16-2 1 power amplifier chip. There are two power management IC printed with Qualcomm Qualcomm logo in the middle, namely PM660 and PM660A, which should be specially prepared for Snapdragon 660.

There is also a WCN3990 chip from Qualcomm, which integrates Bluetooth, WiFi, FM radio, RF and other functions. Originally released to cooperate with Xiaolong 835, it is a supporting scheme to enhance the performance of WiFi. At the same time, it is also the first certified Bluetooth 5.0 commercial solution, providing a transmission speed limit of 24Mbps, which is twice that of Bluetooth 4.2 LTE version. Power consumption is 60% lower than before, and LTE/LAA/Wi-Fi can share antenna design, reducing the use of antennas in mobile phones. In addition, with the support of additional supporting chips, Wi-Fi can achieve 802.4438+05438+0AD Wi-Fi with a maximum of 4.6Gbps.

This time, apart from Snapdragon 660, R 1 1 is another focus, which is also the first product of OPPO equipped with dual cameras. The dual lens of R 1 1 is a connector dual lens, one of which is a wide-angle lens with an aperture of160,000 pixels, using a 6P lens, and the other is a telephoto lens with an aperture of 20 million pixels and an aperture of 2.6, using a 5P lens, produced by SUNNY. Seeing this, you may wonder, isn't the camera Sony's? How did you become Yu Shun? Share a little knowledge with you here. If you are careful enough, you will find that in the PPT or official parameters of many mobile phone products, for the camera part, a CMOS of Sony, that is, the image sensor, is used, not Sony's camera. Generally speaking, Sony only provides CMOS, and does not produce a complete mobile phone camera. Yu Shun Optical Technology is a professional manufacturer of mobile phone lenses, including the focusing module of mobile phone lenses, and Yu Shun Optical Technology is involved. The same type as it is Ofilm, that is, Shenzhen Eurofilm Technology Co., Ltd., lt, which is also a manufacturer of camera modules.