Traditional Culture Encyclopedia - Photography and portraiture - Analysis of Disassembly Characteristics of Four Kinds of Metal Elements Books
Analysis of Disassembly Characteristics of Four Kinds of Metal Elements Books
From the direct experience of users, the notebook made of metal material is obviously superior to the notebook made of plastic material in texture and firmness. Metal material is increasingly used in the design of modern notebooks and gradually becomes the mainstream material. Today, Bian Xiao has brought you four notebooks with different styles and metal design styles, covering business applications, home entertainment, mobile portability and so on. They are Tsinghua Tongfang Tieren K4 1H, Sony SD 19, Samsung 900X3A and Lenovo Zhaoyang K27. Let's take a look at the metal elements used in the disassembly details before we start!
▲ Tsinghua Tongfang K4 1H adopts metal top cover and keyboard metal bracket ▲ Sony SD 19 aluminum-magnesium alloy integrated C panel ▲ Samsung 900X3A's top cover, palm rest, back cover and fuselage are all metal designs ▲ Zhaoyang K27' s top cover, alloy saddle frame, rotating shaft and back cover are all metal designs, and Tongfang Iron Man K4 1H is modular.
As a masterpiece of Tongfang's positioning in the mainstream market, the product specification of 14 inch gives Iron Man K4 1H notebook both performance and portability, and more importantly, while the design and workmanship are further improved, its price positioning completely caters to the psychology of mainstream consumers. But we also have to admit that as a rational businessman, behind the low price, we really need to further control costs to ensure the survival of enterprises. So what is the working material of K4 1H?
▲ Tongfang Iron Man K4 1H Notebook ▲ Tongfang Iron Man K4 1H Keyboard Disassembly ▲ Tongfang Iron Man K4 1H Keyboard chose the popular chocolate design ▲ The bottom of C plane chose the metal support ▲ The C plane of the fuselage mainly relies on screen bolts, and the base was designed without bolts, which is very convenient to disassemble ▲ The bottom of C plane of the fuselage ▲ Tongfang Iron Man K4.
And the core components ▲ processor and graphics card.
The cooling system is designed with double heat pipes and centrifugal fans ▲ 5V/2.05W fans are standard ▲ motherboard chipset.
Choose a unique aluminum radiator ▲ Intel
Core i5-24 10M processor ▲Nvidia GeForce GT525M display core ▲ Intel
HM65 chip ▲ comes standard with Realtek RTL 811E network module ▲ The screen shaft adopts full steel frame structure ▲ The thinnest screen is only 3.6mm▲ It is directly packaged in a dust-free environment, making the structure more solid and compact?
▲ The screen mold adopts bolt-free design ▲ Tongfang Iron Man K4 1H screen editing comments:
Tongfang Iron Man K4 1H Notebook
In design, the practicability of the product is highlighted. Through this borrowing, we also know that the mold design and parts materials of its products are still relatively standard types. Modular packaging display screen is adopted for the first time. The notebook top cover and ultra-thin screen are directly packaged into a whole in a dust-free environment. Compared with ordinary products, the structure is more firm and compact, which fundamentally eliminates the possibility of screen dust, solves the common problems of most computers, and is firm, scratch-proof, clean and beautiful.
K4 1H is very convenient to disassemble, which is beneficial for users to upgrade themselves. Especially in the design of the top cover and cooling system, this product has been improved more than the mainstream entertainment products of the same party in the past, and its products are still very competitive compared with the products with the same price in the market within the price range of 5000 yuan.
Sony SD 19 is ultra-thin due to its high integration.
Sony SD series lightweight business notebooks are worthy of recognition in small and light design, hardware configuration and powerful performance. Of course, many people are curious about its internal design structure. The author will disassemble Sony SD 19 to show you the secret that it can be ultra-thin, light and powerful. Disassembly of the back of the fuselage: optical drive and hard disk
▲ Bottom of Sony SD 19 fuselage ▲ Easy-to-remove back cover design ▲ Memory, hard disk and battery are all under the same back cover ▲ Battery lock ▲ You can see that the built-in memory and motherboard share a PCB board, that is, the motherboard integrates the memory ▲ The hard disk can be properly connected to the motherboard through a cable, and the layout of the hard disk is more flexible ▲ A black diaphragm below the hard disk prevents static electricity ▲ The cable below the diaphragm is arranged densely and orderly ▲ Serial port design, power supply and data interface. Some parts look more concise ▲ Wireless switch ▲ Screw the C panel under the optical drive slot ▲ The keyboard is removed, and the aluminum-magnesium alloy integrated C panel ultra-thin chocolate keyboard ▲ Sony SD 19 adopts the aluminum-magnesium alloy integrated C panel ▲ Very thin, which greatly reduces the thickness of the fuselage ▲ Although it is thin, the alloy material can provide good strength ▲ The back of the C panel ▲ The ultra-thin keyboard and the panel are glued together to avoid further disassembly ▲ The wiring on both sides is neat. And there are special wiring fixing cards ▲ Spread out to compare the C panel as thin as paper ▲ The PCB where the two card readers are located is also fixed with the C panel ▲ The area of the main board under the panel is less than the whole fuselage area 1/3▲ A thin sea surface is adhered to the heat sink next to the fan to provide better air tightness and prevent dust from entering the fuselage ▲ The data and video interface on the right side of the main board is highly integrated with the mini main board? Great wisdom? ▲ Core component layout and cooling system on the motherboard ▲ Two pure copper heat pipes are used to cool the CPU and the single monitor respectively. On the right is a turbofan used to divert air ▲ The front of the motherboard is the bottom of the fuselage, except for the onboard 2GB of memory. There is also a reserved memory slot ▲ The removed cooling system CPU and the pure copper cooling block of the graphics card ▲ are no better than I don't know. The motherboard of such a mini integrates CPU, independent monitor, 4GB memory ▲ Layout of core components on the front of the motherboard ▲ Interface with dense layout on the back of the motherboard, 2GB memory, and 2 video memories ▲ A large number of dense chip capacitors are distributed at the corresponding positions of CPU and graphics card on the back of the motherboard, which is exquisite in workmanship.
Editorial comments
Sony's ability to integrate internal space is really unparalleled. The motherboard integrates memory and adopts ultra-thin magnesium-aluminum alloy integrated C panel. The motherboard of MINI shows Sony's skill in product design. The motherboard is strong, the onboard chips are dense but the layout is reasonable, and many advantages have created such a thin body as SD 19. Although the price is relatively high, it is worth the money. Comparable to Apple Air Samsung 9 series ultra-thin 900x.
Samsung 9 series ultra-thin books have been on the shelves for some time, and almost all media compare each other in performance and appearance.
apple
MacBook Air, but we know that Apple
Product design is fantastic, Samsung.
What is the degree of internal structure design of 9 series books? Let's take a look at the Samsung 900X3A. Samsung 9 Series 900X3A Notebook
The thickness is only16.3mm.. Look at the bottom first. It is not difficult to dismantle the 9 series. First, remove the three screws marked in red in the above picture, then attach decorative glue to the yellow mark at the bottom, and remove the seven screws inside.
After removing the 10 screw, you can open the rear cover. After removing the back shell 10 screw, the back cover can be opened along the edge to reveal the true face of the 9 series, and the red mark is built in.
battery
Space, battery
It has been removed. The battery is fixed with three independent screws and connected to the motherboard with a flat cable.
. The built-in battery capacity is 46Wh, and the red label is left and right channel speakers.
The yellow mark in the above figure indicates that the touchpad module is connected to.
mainboard
Let's go Motherboard configuration dual memory
One of the slots is made by Samsung and has a capacity of 4GB.
internal storage
And there are fragile stickers, and another slot has instructions to add memory, which is very user-friendly. The red mark is 128GB solid state drive produced by Samsung.
128GB Samsung SSD
Samsung front detail photo
The 9-series fan and the compact Samsung 9-series cooling fan are fixed by two screws (the other one has been removed when disassembling the fuselage). Because the low-pressure processor with less heat generation is used, the selected fan is also smaller.
The noise of the fan is extremely low. Through the seamless contact between the heat sink and the chip, the heat sink of the processor can be removed only by removing four screws. It has a copper tube connecting the processor and the chip.
mainboard
The chip, the chip and the radiator are in seamless contact. The design of radiator also follows the schematic diagram of the interface module on the right side of ultra-thin fuselage. Schematic diagram of interface on the left side of fuselage. To remove the rotating shaft of the screen, it is necessary to remove the protective shell fixed with the 1 screw. After removing the protective shell, remove the two screws marked in red in the above picture to complete the separation of the screen from the body.
On the other side, the screen shaft protective shell and screws are also removed and taken to the motherboard.
The small circuit board and sound card are in the lower right corner of the bracket.
The chip is right here. After removing the four screws on both sides of the rotating shaft, it can be separated from the screen and motherboard.
It is fixed on the bottom shell by four screws. Because the motherboard is highly integrated, there are many cable sockets around the motherboard besides the cables just plugged into the surface, so be sure to separate them.
After the motherboard is removed, the antenna, touchpad and keyboard are basically left.
Motherboard chips mostly use high-end materials. Main board structure's design is reasonable, and the firmness is really good when taken apart, which belongs to the upper-middle level. The layout and spacing of chips on the motherboard are very reasonable, and most of them are medium and high-end materials, which are directly proportional to the price of more than 10 thousand yuan. In the afternoon, you can click on the big picture that can be enlarged. Interested friends can have a look.
▲ Large image of the motherboard (click to enlarge) The keyboard is directly attached to the back of the motherboard.
▲ Finally, come to the editor's summary of Zhang's family.
: Through Samsung
With the complete disassembly of 900X3A, it is obvious that Samsung has really made great efforts in the R&D and design of 9 series products. It is no exaggeration to say that this product is really qualified to be among the best in international industrial design and manufacturing. No matter the design and technology of the fuselage or the material and layout of the motherboard, it is an excellent product. Made in China Lenovo Zhaoyang K27
Lenovo Zhaoyang is divided into four series, and our dismantled Zhaoyang K27 is a business notebook convenient for top business users. So what should I pay attention to in this disassembly? Key words: hard alloy top cover palm rest, reinforced alloy screen shaft, alloy pommel horse frame, three-stage heat dissipation, hard disk protection system, etc.
First open the rear cover of the fuselage. You need to unscrew the six screws marked in red in the above picture. The back cover of K27 is made of all metal. The metal back cover can not only shield the electromagnetic radiation interference, but also play a certain auxiliary role in the heat dissipation of the fuselage. Moreover, there are many cold air inlet windows on the back cover, which is also the first stage of three-stage heat dissipation.
So this design is actually to install a ring buckle at the bottom of the screw thread, so that even if you open the back cover at will, you don't have to worry about losing the screw.
After the back cover is removed, the northern part of K27 is still very open, with hard disk marked in red, cooling fan set marked in blue and two memory slots marked in yellow.
Brand-new hard disk shock-proof vest The hard disk shock-proof vest adopts the dual design of cushioning rubber pad and metal frame to form armor protection for the hard disk, which greatly reduces the risk of data damage or loss caused by external physical impact and collision.
After removing the hard disk from the metal frame, you can see the black rubber pad in the middle interlayer. Remove the cooling fan, the five screws marked in red, and the Phoenix III cooling group. Of course, remember to separate the plug at the yellow mark.
K27 adopts pure water heat pipe design. This heat pipe design has higher heat transfer efficiency, and the processor is in seamless contact with the heat sink, which is more conducive to heat export. This is also one of the so-called three-stage heat dissipation in Zhaoyang.
The Bluetooth module of K27 is placed next to the hard disk compartment, and the details of fixing the Bluetooth module with two screws are shown below. After removing the 12 screw on the back of the fuselage, you can pry up the power switch panel with the removal tool. You must pay attention to skills when prying the panel. Don't force it. Although all the screws have been removed, the buttons are still tight.
The power switch and system reset key control the keyboard, mute key on the upper left of the motherboard and other shortcut keys. Careful friends can find that many key parts of Zhaoyang series are affixed with stickers with Chinese names (marked in blue in the above picture). Although we don't know whether the representatives are manufacturing workers or quality inspection workers, they all prove their progress in process monitoring.
Zhaoyang K27 adopts splash-proof keyboard with drainage system. The leakage hole of the keyboard is large and corresponds to the position of the keyboard hole, which leads to a short path of the sink to facilitate the discharge of liquid, and the curling around the keyboard is increased to reduce the risk of overflow.
Zhaoyang K27 integral aluminum alloy pommel horse frame strengthens the protection of key components in the system, improves the rigidity of the overall performance and increases the safety factor of the whole machine.
Use disassembly tools to pry the back of C surface along the edge of D surface of C surface, and you can see that the protection of alloy pommel horse frame extends to the back of palm rest. It can be said that the pommel horse frame supports the whole fuselage and improves the firmness of the whole fuselage.
After the fingerprint reader of K27 removed the pommel horse frame, the metal screen shaft of K27 was exposed on the back of the whole motherboard, and it was fixed on the D-side fuselage by two left and right screws (marked in red in the above picture).
Separated K27 sieve Zhaoyang K27 shaft adopts 180 degree reinforced alloy sieve shaft. After the screen shaft has been opened and closed for more than 25,000 times, the cable at the red mark should be disassembled first, and the two cables should be separated up and down. Then, you can remove the screw at the red mark and separate this small board, which is equipped with a power adapter jack and a USB2.0 interface. After removing the motherboard chassis, only two speakers (marked in red) remain.
The motherboard is well designed and the defect position is just right. Many friends care whether the motherboard HM65 chipset is B2 or B3. The serial number of the disassembled motherboard chipset is SLJ4P, and the corresponding list given by Intel shows that its corresponding step is B3.
Details of motherboard interface: the processor is powered by a sound card chip, and the back of the processor is covered with red tantalum capacitors. Details of the motherboard: First of all, I was impressed by Bian Xiao, which is very robust. The layout and spacing of the chips are very reasonable from the perspective of the board and the mutual support with the fuselage, showing the style of big manufacturers, and the materials used on the motherboard are all above the middle end. This technology and material not only fully ensure the stability of the system operation, but also reduce the failure rate.
K27 is torn down, so let's have a family portrait summary.
From the perspective of disassembly, K27 is not only more exquisite in workmanship, but also shows Lenovo's great efforts in product development and design, especially in tiny details. If you are strict with your work attitude, strict with the quality of goods around you, and attach great importance to the precipitation and inheritance of culture, then choosing a Zhaoyang business notebook to accompany you is definitely a wise choice!
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